Semiconductor Construction

Welding System I-ARC200+TC
Welding Process TIG
Material Stainless Steel
Size of Workpiece φ3—φ25
Wall Thickness <3mm
Joint Type Butt to Butt
Application Industry Semiconductor Construction

Features:

  • According to the welding application from pharmacy, the system mainly includes orbital welding power source, welding head with option of water cooling
  • Fusion welding
  • Water circuit cooling design for longtime working
  • Remote pendent for long distance control
  • Open window for checking alignment after assembly
  • Suitable for stainless steel and titanium alloy workpieces of small diameter and thin-wall thickness
  • Widely applied in medicine, food, biological, electrics, instrument and pipe installation industries